Mechanical Engineer

Piper Companies is seeking a senior Mechanical Engineer with strong experience designing, developing and optimizing hardware systems. The ideal Mechanical Engineer must be willing to work onsite 5 days a week in Saratoga, CA.

Requirements for a Mechanical Engineer include:

·       Create and optimize the mechanical design of components and chassis for rack mounted computing and communication systems

·       Develop the mechanical design of IC packages including thermal management, electrical performance, and mechanical integrity

·       Conduct simulations and analyses to predict and optimize the structural integrity and thermal performance of electrical and optical packages

·       Develop prototypes of system chassis and electrical/optical packages

Qualifications for a Mechanical Engineer include:

·       10+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing

·       In-depth knowledge of air and liquid cooling systems

·       Experience working with 2.5 D and 3D packaging technologies

·       Proficiency in CAD software (SolidWorks, AutoCAD) for 3D modeling and design

·       Experience with simulation tools (ANSYS, COMSOL) for analyzing thermal and mechanical behavior

·       Bachelors in Material Science, Mechanical Engineering, or equivalent industry experience

·       Must be eligible to work in the United States and obtain and maintain an Active U.S Government Secret Clearance

Compensation for a Mechanical Engineer include:

·       Salary range: $150,000 - $180,000 annually

·       Comprehensive benefit package; Cigna Medical, Cigna Dental, Vision, 401k w/ ADP plus PTO, Sick leave if required by law, and Paid Holidays

Keywords: Mechanical engineer, engineer, data centers, datacenters, mechanical design, chassis, rack mounts, air cooling systems, liquid cooling systems, air cooling, liquid cooling, electrical components, optical components, thermal performance, IC packages, IC package, thermal management, electrical performance, mechanical integrity, SMT, solder ball, network products, network, photonics, design analysis, simulations, simulation analyses, thermal analysis, thermal cycling, vibration testing, flip chip, 2.5D packaging technology, 3D packing technology, TSV, CAD software, SolidWorks, AutoCAD, 3D modeling, 3D design, simulation software, simulation tools, ANSYS, COMSOL

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This job opens for applications on 12/20/2024. Applications for this job will be accepted for at least 30 days from the posting date.