Package Layout Designer (Substrate)

Piper Companies is hiring a Package Layout Designer (Substrate) for a small start up based in Saratoga, CA. The Package Layout Designer (Substrate) will be driving the entirety of the layout to come up with a conclusion for this packaging and design the physical layout for package substrate technology. The Package Layout Designer (Substrate) will need to sit on site 5 days per week in Saratoga, CA.

Responsibilities for the Package Layout Designer (Substrate):

• Drive high-density substrate designs for advanced multi-die packages
• Plan bump maps, escape routes, vias, and layer stack-ups
• Assess routing feasibility with respect to die layout and mechanical constraints
• Align floor planning with system, packaging, and mechanical teams
• Optimize signal, power, and ground integrity through smart routing
• Perform DRC, DFM, and manufacturing rule checks
• Finalize design packages and coordinate with substrate vendors
• Support layout reviews and incorporate stakeholder feedback

Requirements for the Package Layout Designer (Substrate):

• 8+ Years of experience designing the physical layout design for package substrate technology
• Expertise in layout design work
• Experience working with ASIC, Signal and Power Teams
• Advance Knowledge in Allegro Cadence APD and AutoCAD design tools

Compensation for the Package Layout Designer (Substrate):

• $180,000 - $270,000
• Full Comprehensive Benefits: Health, Vision, Dental, PTO, Paid Holiday, Sick Leave if Required by law

Keywords: substrate design, multi-die packages, bump mapping, escape routing, via structures, layer stack-up, routing feasibility, die floorplanning, IO bump placement, mechanical constraints, floor planning, system architecture, packaging collaboration, mechanical integration, signal integrity, power integrity, ground integrity, design constraints, DRC, DFM, manufacturing checks, fabrication readiness, final design packages, vendor coordination, layout reviews, stakeholder feedback

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This job opens for applications on 6/27/2025. Applications for this job will be accepted for at least 30 days from the posting date.