Advanced Packaging Engineer – High-Performance Systems Integration

We are seeking a highly experienced Advanced Packaging Engineer with deep expertise in substrate layout, system integration, and packaging technologies. This is a high-impact, on-site role focused on advanced organic substrate layout, routing feasibility, and co-design alignment across floorplanning, mechanical, and system-level constraints. You’ll be part of a small, expert team shaping the physical implementation of a first-of-its-kind high-performance package. This position is a hybrid role located in Saratoga, California.

Responsibilities of the Advanced Packaging Engineer:

• Drive initiatives for advanced packaging technologies, including substrate layout and system-level integration
• Collaborate closely with TSMC in Taiwan and local engineering teams to develop and implement packaging solutions
• Lead co-design efforts across electrical, mechanical, and thermal domains to ensure alignment with system-level constraints
• Evaluate and optimize routing feasibility and substrate design for high-performance applications
• Integrate advanced packaging technologies such as CoWoS into system architectures
• Support cross-functional teams in the development of 2.5D/3D stacking and heterogeneous integration solutions

Qualifications of the Advanced Packaging Engineer:

• 15+ years of experience in advanced packaging technology development and system integration
• Proven ability to wear multiple hats and lead cross-functional initiatives across global teams
• Deep understanding of CoWoS technology and its application in high-performance systems
• Strong system-level background with experience integrating packages into full systems
• Knowledge of 3D stacking and heterogeneous integration (preferred)
• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, or related field
• Background in Materials Science is helpful; Master’s degree is a plus

Compensation of the Advanced Packaging Engineer:

• Salary Range: $190,000 – $270,000, based on experience
• Location: On-site (U.S. based)
• Benefits: Medical, Dental, Vision, 401K, PTO, parental leave, and sick leave as required by law

Application Details:

• Job opens for applications on: 07/02
• Applications will be accepted for at least 30 days from the posting date

Keywords:

Advanced Packaging, CoWoS, Substrate Layout, System Integration, TSMC, 3D Stacking, Organic Substrate, High-Performance Computing, Mechanical Engineering, Electrical Engineering, Materials Science, Floorplanning, Routing Feasibility, Heterogeneous Integration

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