Advanced Packaging Engineer - CoWoS

Piper Companies is looking for an Advanced Packaging Engineer - CoWoS to join a cutting-edge semiconductor organization to help drive innovation in advanced packaging technologies and integrating them into high-performance systems. The ideal Advanced Packaging Engineer - CoWoS must work on site in Saratoga, CA Monday through Friday to deliver next-generation packaging solutions.

Responsibilities for Advanced Packaging Engineer - CoWoS:

• Lead initiatives in advanced packaging technologies with a focus on system-level integration and manufacturability.
• Help design and layout high-density organic substrates for multi-die packages from concept to release.
• Be the go-to expert for bump mapping, escape routing, and layer stack-up strategies.
• Collaborate with cross-functional teams to align die floorplans with mechanical and system-level constraints.
• Collaborate with substrate vendors and OSATs (Outsourced Semiconductor Assembly and Test) to develop and implement packaging solutions.
• Drive the integration of CoWoS and other advanced packaging technologies into system designs.
• Support cross-functional teams in aligning packaging strategies with system performance and reliability goals.

Qualifications for Advanced Packaging Engineer - CoWoS:

• 10+ years of experience leading advanced packaging technology initiatives in the semiconductor industry.
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
• Proven experience working with substrate vendors and OSATs to deliver high-performance packaging solutions.
• Deep understanding of CoWoS technology and system-level packaging integration.
• Expert in designing high-density organic substrates, including fine-pitch bump routing and complex layer stack-ups.
• Skilled in using design tools like Cadence Allegro APD and AutoCAD.
• Knowledge of 3D stacking technologies is a strong plus.
• Master's degree in Electrical Engineering, or related field required; Background in materials science is helpful.

Compensation/Benefits for the Advanced Packaging Engineer - CoWoS:

• Salary Range: $180,000 – $265,000 annually (based on experience and qualifications)
• Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (if required by law), and Holidays

This job opens for applications on 2/18/2026. Applications for this job will be accepted for at least 30 days from the posting date

Keywords: Advanced Packaging, CoWoS, OSAT, Substrate, 3D Stacking, Semiconductor Packaging, System Integration, High-Density Interconnect,, Packaging Reliability, Materials Science,  bump mapping, escape routing, layer stack-up strategies, Cadence Allegro APD, system-level packaging

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