Advance Packaging Engineer

Piper Companies is seeking an Advanced Packaging Engineer to support a leading organization in the semiconductor and high‑performance computing industry. The Advanced Packaging Engineer will play a critical role in next‑generation single‑chip, SoC, and multi‑component module packaging technologies, including CoWoS, 2.5D, and emerging 3D/TSV‑based integration.

Responsibilities of the Advanced Packaging Engineer:

• Drive development of advanced single‑chip flip‑chip packaging and complex SoC/multi‑component module assemblies.

• Lead design, analysis, and integration efforts for CoWoS, 2.5D, and early‑stage 3D/TSV packaging solutions.

• Develop and optimize organic substrate architectures for high‑density, high‑performance applications (critical must‑have).

• Collaborate with foundry partners, including TSMC, to support system‑on‑wafer packaging technology.

Qualifications of the Advanced Packaging Engineer:

• 5+ years of experience in advanced semiconductor packaging engineering.

• Strong technical background in single‑chip flip‑chip packaging and SoC/multi‑component module integration.

• Hands‑on expertise with CoWoS, 2.5D, and exposure to 3D/TSV packaging methodologies.

• Deep understanding of organic substrate technology—this is a mandatory requirement.

• Experience collaborating with TSMC on system‑on‑wafer development.

• Knowledge of thermal, mechanical, and reliability modeling tools and best practices.

Compensation for the Advanced Packaging Engineer includes:

• Salary range: $200,000 - $220,000 depending on experience

• Comprehensive benefits package including medical, dental, vision, 401(k), and PTO

This job opens for applications on 02/23/2026. Applications for this job will be accepted for at least 30 days from the posting date.

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