Organic Substrate Design Engineer

Piper Companies is seeking an Organic Substrate Design Engineer to support advanced packaging initiatives within a leading semiconductor-focused organization. The Organic Substrate Design Engineer role is ideal for an experienced engineer with deep expertise in substrate design, module integration, and hands‑on collaboration with global subcontractors. The Organic Substrate Design Engineer requires you to sit onsite in Saratoga, CA 5 days per week.

Responsibilities of the Organic Substrate Design Engineer:

• Execute organic substrate and flip‑chip substrate design activities for advanced semiconductor packaging programs.

• Develop multi‑layer substrate architectures, HDI layouts, and design solutions that improve module yield and performance.

• Collaborate closely with OSAT partners and Taiwan‑based subcontractors to ensure manufacturability, material selection, and build success.

• Support substrate stack‑up development, routing optimization, and electrical/mechanical design reviews.

• Utilize Siemens Xpedition (preferred tool) to drive detailed layout execution and design validation.

• Work cross‑functionally with packaging, mechanical, and electrical engineering teams to deliver optimized substrate designs.

Requirements of the Organic Substrate Design Engineer:

• 10+ years of experience in advanced packaging, substrate design, or module integration.

• Strong background in organic substrate technology and flip‑chip substrate design principles.

• Hands‑on experience collaborating with OSATs and Taiwan subcontractors.

• Proficiency with multi‑layer substrate concepts, HDI design methodologies, and yield‑driven optimization strategies.

• Experience using Siemens Xpedition (preferred tool for this role).

Compensation for the Organic Substrate Design Engineer:

• $235,000 - $265,000 base salary

• Full Comprehensive Benefits: Health, Vision, Dental, PTO, Paid Holiday and Sick Leave if Required by Law.

Keywords: organic substrate, flip‑chip design, HDI substrate, multi‑layer substrate, advanced packaging, OSAT collaboration, Siemens Xpedition, semiconductor packaging, module integration, substrate engineering

This job opens for applications on 3/6/2026. Applications for this job will be accepted for at least 30 days from the posting date.

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