Thermal Engineering – Liquid Cooling

Piper Companies is seeking a Thermal Engineering – Liquid Cooling specialist to support a leading organization in the high‑performance computing and advanced hardware systems industry. The Thermal Engineering – Liquid Cooling role is ideal for an experienced engineer with deep expertise in server‑class liquid cooling, cold plate design, and high‑volume production thermal solutions.

Responsibilities of the Thermal Engineering – Liquid Cooling:

• Lead liquid‑cooling development activities for server‑class compute systems from concept through high‑volume production.

• Drive cold‑plate design, optimization, validation, and integration for next‑generation compute hardware.

• Use thermal simulation tools such as Ansys Icepak (ideal), FloTHERM, FlowFD, or Fluent to model, analyze, and refine cooling solutions.

• Collaborate with OSAT manufacturers to support thermal packaging, manufacturing readiness, and process alignment.

• Work closely with global engineering teams, including Taiwan subcontractors, to ensure cooling requirements meet system, packaging, and reliability standards.

• Support module‑level and system‑level thermal characterization and performance testing.

• Apply deep thermal engineering knowledge to improve efficiency, reliability, and manufacturability of liquid‑cooled solutions.

Qualifications of the Thermal Engineering – Liquid Cooling:

• 5+ years of experience in liquid‑cooling thermal engineering for electronics, with a proven track record of bringing solutions from concept to high‑volume production.

• Strong experience with liquid cooling for server‑class compute systems (not EV, automotive, or consumer electronics).

• Deep knowledge and hands‑on experience with cold‑plate design.

• Proficiency with thermal simulation tools: Ansys Icepak (ideal), FloTHERM, FlowFD, Fluent (acceptable), COMSOL (helpful but not primary).

• Experience working with OSAT manufacturers on thermal or packaging‑related builds.

• Ability to interface effectively with Taiwan subcontractors.

• Familiarity with environments similar to advanced liquid‑cooled compute leaders (e.g., NVIDIA, Google, Meta, Tesla—compute/server divisions, IBM).

Compensation for the Thermal Engineering – Liquid Cooling includes:

• Salary range: $250,000 - $300,000

• Comprehensive benefits package including medical, dental, vision, 401(k), and PTO

This job opens for applications on 04/17/2026. Applications for this job will be accepted for at least 30 days from the posting date.

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