Advanced Packaging Engineer

Piper Companies is hiring an Advanced Packaging Engineer to work onsite in Saratoga, California. The Advanced Packaging Engineer will lead system module packaging and advanced IC integration for high-performance networking and computer hardware. The Advanced Packaging Engineer will own end-to-end productization across architecture, manufacturing, and qualification, driving module designs into production.

Responsibilities for the Advanced Packaging Engineer include:

• Own full lifecycle of system module packaging from architecture through high-volume production, including organic substrates, interposers, cooling, boards, and mechanical hardware
• Lead module manufacturing with contract manufacturers and internal teams, including build execution, yield tracking, and process improvement
• Drive mechanical modeling (warpage, stress, coplanarity) to validate design and ensure manufacturing readiness
• Execute qualification efforts including Mechanical Test Vehicles (MTVs), failure analysis, and root cause resolution
• Interface directly with OSATs, foundries, and Taiwan-based subcontractors to align assembly processes and advanced packaging technologies

Qualifications for the Advanced Packaging Engineer include:

• 8+ years of experience in advanced IC packaging, module assembly, and manufacturing
• Bachelor’s, Master’s, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
• Organic substrate packaging and multi-layer substrate expertise, including module integration ownership
• Experience working with TSMC engagements, CoWoS technologies, and advanced packaging architecture
• Ability to collaborate with Taiwan-based subcontractors and work onsite in Saratoga, CA Monday-Friday

Compensation for the Advanced Packaging Engineer includes:

• Salary: $200,000-$250,000 annually, based on experience
• Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave as required by law, and Holidays

This job opens for applications on 06/05/2026. Applications will be accepted for at least 30 days from the posting date.

Keywords:

Advanced Packaging Engineer, Organic Substrates, CoWoS, TSMC, 2.5D Packaging, Flip Chip, SMT Assembly, Module Integration, Semiconductor Packaging, OSAT, Failure Analysis, Mechanical Modeling, High-Performance Computing, Networking Hardware, Saratoga CA

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